By Suryadevara Babu
Advances in Chemical Mechanical Planarization (CMP) provides the newest info on a mainstream technique that's severe for high-volume, high-yield semiconductor production, or even extra in order equipment dimensions proceed to lessen. The know-how has grown to surround the removing and planarization of a number of steel and dielectric fabrics and layers either on the equipment and the metallization degrees, utilizing diverse instruments and parameters, requiring advancements within the keep an eye on of topography and defects.
This very important ebook deals a scientific evaluate of basics and advances within the zone. half One covers CMP of dielectric and steel movies, with chapters concentrating on using specific recommendations and tactics, and on CMP of specific numerous fabrics, together with extremely low-k fabrics and high-mobility channel fabrics, and finishing with a bankruptcy reviewing the environmental affects of CMP procedures.
Part addresses consumables and procedure regulate for stronger CMP, and contains chapters at the coaching and characterization of slurry, diamond disc pad conditioning, using FTIR spectroscopy for characterization of floor strategies, and methods for defection characterization, mitigation, and reduction.
- Considers innovations and approaches for CMP of dielectric and steel films
- Includes chapters dedicated to CMP for specific materials
- Addresses consumables and strategy regulate for stronger CMP
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Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials) by Suryadevara Babu